OpenVPX
-
Pentek Announces Kintex UltraScale Co-processor Jade XMC for Signal Processing Applications
Jade Architecture with Xilinx Kintex UltraScale FPGA *Provides up to 5520 DSP slices and 1.4 million logic cells *Navigator Design Suite for streamlined IP development *XMC (VITA 42) with PCIe Gen 3 x8 interface *Available in commercial and rugged versions in multiple form factors
-
Pentek Announces Talon Rugged Small Form Factor RF/IF Recorders Optimized for SWaP
*200 MS/sec to 3.6 GS/sec ultra-wideband RF/IF inputs *Real-time aggregate recording rates up to 4 GB/sec *SSD RAID storage capacity up to 30.7 TB using NTFS files *Small form factor 17-pound chassis
-
Concurrent Technologies announces a range of 3U VPX(tm) I/O boards
The first two products in Concurrent Technologies' new range of 3U VPX(tm) I/O boards include a multi-channel serial board and a multi-channel Gigabit Ethernet board. These boards complement the extensive range of processor cards now available to aid system integrators construct solutions with lots of I/O channels to satisfy applications in the defense, transportation, test, instrumentation and industrial markets. Both boards require a single 3U VPX(tm) slot and are available for both air and conduction-cooled applications.
-
Curtiss-Wright Brings Advanced NVIDIA(r) Pascal(tm) GPGPU COTS Solutions to Demanding ISR/EW Applications
NVIDIA QUADRO(r) PASCAL GPGPU-BASED OPENVPX(tm) AND XMC MODULES SPEED AND EASE THE DEVELOPMENT OF HIGH PERFORMANCE EMBEDDED COMPUTING (HPEC) SYSTEMS
-
ANSI and VITA Ratify ANSI/VITA 68 VPX Compliance Channel Standard
Family of standards for signal integrity compliance of VPX systems and components.
-
Transport Ticketing Market is to grow at a CAGR of 10% by Forecast to 2023
Transport Ticketing Market, By Product (Ticket Machine, E-Ticket, E-Kiosk, E-Toll), By System (Smart Card, Smart Phone) - Forecast 2023
-
Intel's Xeon-D 10 Gig connectivity drives demand for VITA 76 connector high-speed signal integrity
The recent introduction of Intel's first Xeon System-on-a-Chip (SoC) device, the Xeon-D (codenamed "Broadwell DE"), dramatically changes the range of options for designers of high-performance small-form-factor (SFF) mission computers. Compared to earlier Core/Atom devices, the Xeon-D provides more cores and threads per central processing unit (CPU) - up to 16 cores/32 threads - and adds a significantly greater number of Peripheral Component Interconnect Express (PCIe) lanes (32 PCIe lanes for Xeon-D, compared to 16 lanes for Core i7 or six lanes max for Atom). The Xeon-D also natively provides support for a large number of fast USB 3.0, USB 2.0, 1 Gigabit Ethernet (GigE), and serial interfaces. Most notably, a significant leap forward for designers of modern mission computers is Xeon-D's support for 10 GigE.
-
Managing the infinite possibilities: How to cope with the many I/O options of VPX
Thanks to its flexibility, performance, and suitability for harsh and varied environments, VPX - especially the size, weight, and power-cost (SWaP-C)-friendly 3U VPX - has rapidly established itself as the form factor of choice for aerospace and defense programs. The majority of new opportunities are in the 3U VPX VITA 48.2 (conduction cooled) form factor, housed in an ARINC 404 enclosure, commonly called Air Transport Rack (ATR). ATR enclosures are notorious for restrictive I/O limitations.
-
Securing embedded systems based on Open System Architectures
Many of the standards developed by VITA working groups are for defining modules that are part of Open System Architectures (OSA) - whether they are VME, VPX, PMC, FMC or one of many other standards. These modules are used to build critical embedded systems that are deployed in a variety of application platforms. Today these platforms are typically connected via a network, a network that is often susceptible to cyberattacks. This article introduces you to high level concerns and challenges facing designers using Open System Architecture (OSA) modules.
-
Global Automation Substation Market Likely to Grow at Over 6% CAGR through 2022, North America to Lead the Global Market
Use of automated substations has been shown to increase the transmission, and as conventional grids make way for smart grids, automation of substations is likely to gain traction.