ADLINK Launches Extreme Rugged(tm) HPERC-IBR for Reduced SWaP Requirements

VITA-75 compliant COTS solution targets mission critical applications for ground and air vehicles

ADLINK Technology, Inc., a leading provider of embedded computing products and application Ready intelligent platforms (ARIP), today announced release of the new Extreme Rugged™ HPERC-IBR system. The HPERC™ (High Performance Extreme Rugged Computer) Series offers a compact, highly reliable and efficient processing unit to meet challenging SWaP (Size, Weight and Power) requirements for modern ground and aerial vehicle applications. HPERC offers one of the first product implementations of the VITA-75 standard to address commercial off-the-shelf (COTS) requirements for Unmanned Ground Vehicle (UGV) applications.

"The HPERC system offers intense capabilities in a VITA-75 footprint, leveraging Intel® Core™ i7 processing power coupled with a GPGPU and a wealth of I/O support for camera and vehicle data busses," said Jeff Munch, Director of ADLINK's Small Form Factor Product Center. "This solution can readily provide the necessary image processing and I/O required for UGV applications both today and in the future."

In addition to the 3rd Generation Intel Core processor and optional GPGPU, the HPERC-IBR also offers DDR3L-1333 ECC soldered down memory up to 16GB, dual removable solid state drives with available RAID 0/1, as well as 4 USB 3.0, 2 USB 2.0, 4 Ethernet, 7 Serial, 8 GPIO, and 3 HDMI/DisplayPort/DVI interfaces. The HPERC-IBR also has expansion options to support fast and easy integration of additional interface cards such as PCI/104-Express and Mini PCI Express.

To endure harsh environments, the HPERC-IBR was developed using ADLINK's Rugged by Design methodology to withstand extreme shock, corrosion and galvanic oxidation. The HPERC-IBR offers flexible cooling options: the HPERC-IBR-MC (-40°C to + 85°C) for cold-plate cooling and the HPERC-IBR-MH (-40°C to + 75°C) designed for natural convection cooling.

The ADLINK HPERC Series is compliant to VITA-75 20/21/22 small form factor mounting and provides a wide array of fast I/O via MIL-DTL-38999 connectors. Additional expansion interfaces to meet the demands of various sensor suites are easily added with user-defined I/O pins.