News - New Products
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DDR4 memory on prototypes and production PCBs can be quickly tested with ASSET InterTech's ScanWorks
Engineers designing with Double Data Rate 4 (DDR4) memory devices can quickly deploy tests for shorts and opens on control, address and data lines with the boundary scan test (BST) tools of ASSET InterTech's ScanWorks(r) platform for fast test and programming. Downloadable models of DDR4 memory devices can be rapidly integrated into a ScanWorks Memory Access Verify (MAV) test action, which can then test the access to on-board DDR4 memory. With the ScanWorks MAV test action, shorts and opens testing of DDR4 memory devices can begin with board prototypes in development and continue on to production units in manufacturing.
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Saelig Introduces USB 3.0 SuperSpeed Isolator For Electrical Isolation of USB Ports
USB 3.0 SuperSpeed Isolators eliminate ground loops and ground potential differences and are ideal for measurement, industrial, automotive and audio technology applications.
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Pentek Expands Talon Extreme Rugged 1/2 ATR Recorder Family
*Eight-channel phase-coherent RF/IF Recorder *Up to 4 GB/s real-time recording rate *Removable SSD QuickPac drive pack holds up to 30.7 TB *Environmentally-sealed, conduction-cooled design ideal for harsh mechanical and thermal environments such as UAV's, aircraft pods and military vehicles
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XPand6215 Redefines What is Possible in an Embedded, SWaP-Optimized System
Revolutionary Performance in a Small Form Factor Enclosure The XPand6215 is latest 3U VPX embedded system from Extreme Engineering Solutions (X-ES), and it sets a new standard for high-bandwidth data acquisition and signal processing in harsh environments. With multiple high-speed optical links, an Intel(r) Xeon(r) D-1500 processor, and a Xilinx Kintex(r) UltraScale(tm) FPGA, the XPand6215 offers uncompromising performance and reliability in a SWaP-optimized two-slot system.
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TE Connectivity's high frequency nanominiature contact doubles density, reduces packaging
A higher density RF coax module, twice the density of VITA 67 SMPM RF modules used in VPX embedded computing applications. Half and full size module sizes can retain up to 12 or 18+ RF contacts, with options for customizing contact count and position.
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Annapolis Micro Systems Ships First 100Gb-Capable COTS FPGA Board, for High-Bandwidth Applications
Annapolis Micro Systems, a leading FPGA board and systems supplier, is now shipping its first COTS FPGA board with 100Gb capability.
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Pixus Releases New Development Chassis for 3U OpenVPX Boards
Pixus Technologies, a provider of embedded computing and enclosure solutions, has released 3U versions of its low-cost open frame development platform for OpenVPX and other architecture backplane systems.
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Pentek's New Quartz RFSoC Development Platform Speeds Application Design
*Low-cost, single-slot 3U VPX development chassis *Supports Pentek's Quartz RFSoC FPGA products *Dual MPO optical interfaces support 100 GigE high-speed data streaming *Ideal for defense, radar, wireless, SIGINT and DRFM applications
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Pixus Offers VITA 67 Backplanes for RF over OpenVPX
Pixus Technologies, a provider of embedded computing and enclosure solutions, has developed a new line of 3U and 6U OpenVPX backplanes with provisions for RF cabling per VITA 67. The backplanes come in various sizes and slot configuration options.
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Curtiss-Wright Debuts Compact, Pre-Integrated EW RF Tuner Mission Computer Featuring Leonardo DRS SI-9172 Vesper Tuner/Exciter
NEW MPMC-9323 EWS-DRS MISSION COMPUTER SPEEDS DEVELOPMENT/DEPLOYMENT OF HIGH PERFORMANCE EW/RF APPLICATIONS WITH COTS-BASED OPEN ARCHITECTURE SOLUTION
Robert Russell Greenfield
Saelig Co. Inc.
Barbara Stewart
Curtiss-Wright Defense Solutions