Serge Tissot, Kontron

• Designing with VPX: Ensuring efficient speed, cooling, and interoperability

  

  Of the two VPX mechanical form factors, 3U is very popular in certain applications, and 6U is sometimes necessary to build highly parallel systems with optimal computing density. While air and conduction cooling are often implemented to address cooling challenges, liquid cooling solutions can be effective for designs at the chassis, board, and chip levels. Today’s designs must be standardized for VPX to maintain interoperability and availability of common building blocks, and to ensure the success of this modular architecture now and in the future.

  Serge Tissot Kontron