jimmosier
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Advancing electronic packaging with optics gives VPX a 450% bandwidth boost
Implementing optics for Level Four electronic subassembly packaging in VPX systems enables significantly higher bandwidth over purely copper interconnects. The signal-processing requirements of today’s active electronically scanned antenna (AESA) radar, infrared search and track (IRST), and surveillance systems are demanding. This situation challenges designers to squeeze more processing power and electronics into VPX (ANSI/VITA 46) [...]
Jim Mosier, TE Connectivity