Brian Hoden, GE Intelligent Platforms, Inc.

• The cutting edge of thermal management

  Brian Hoden, GE Intelligent Platforms, Inc.

  The biggest challenge for system integrators today is thermal management. With access to the latest-generation processors, GPUs, and switch fabrics, system integrators must find creative ways to remove the heat created by this vast computing power. These thermal challenges call for innovative thermal solutions to maximize the performance for computing-intensive applications.